DuraPak™
Unparalleled value for BGAs
• Cost-effective probe architecture for high-volume production test of BGAs
• Single-ended probe design provides a single wiping surface, resulting in stable contact resistance
• Six-point crown provides direct alignment to solder balls of 0.75, 1.0, and 1.27 mm pitch devices
• Bandwidth up to 7.6 GHz provides reliable performance for medium-speed devices
Product Data Sheet  
Product Specifications Summary
Package Types:
 CSP, BGA, LGA, PBGA, CBGA, QFP, TSOP, others
Bandwidth: 0.80mm pitch: 6GHz @ -1dB
1.00mm pitch: 7GHz @ -1dB
1.27mm pitch: 8GHz @ -1dB
Inductance : 0.80 mm pitch: 1.43 nH
1.00 mm pitch: 1.23 nH
1.27 mm pitch: 1.30 nH
Test Height : All pitches: 0.188in / 4.78mm
Probe: