Test Socket and Probe Minimizes High Frequency Attenuation, Reduces Contactor Reload Times
First product offering from new ECT Semiconductor Test Group streamlines final package array IC test with fully integrated sockets and loadboards, including an autoloader.
San Jose, California, July 14,1999 - For years, the biggest names in electronics manufacturing have turned to Everett Charles Technologies (ECT) for test and probe solutions in loaded and bare board test. Now, in semiconductor test, ECT offers a streamlined design for BGA and other area array packages. A high-performance test socket and contactor combination: The BantamPak ", offered with an autoloader for fast reloading and an integrated loadboard for high speed performance. BantamPak" merges decades of spring-probe expertise from Everett Charles Technologies with the advanced loadboard knowledge of industry leader ESH, acquired by ECT in a prior merger. Proprietary POGOŽ technology, in widespread use within the PC board test community, is enhanced, resulting in larger surface area, greater strength and longer life. In one version the test length of the spring probe is only 0.096". The initial design from the newly formed Semiconductor Test Group at ECT is believed to represent the smallest contactor now offered for this application, lowering capacitance rates and self inductance and increasing bandwidth.
The Semiconductor Test Group has created an optional reload pallet for BantamPak" pins, which reduces reprobe lead times to a matter of minutes. Along with its autoload device, the company stresses that a companion loadboard from its Test Group will fully integrate the component parts and provide a comprehensive test interface for the user.
According to ECT, the patent-pending BantamPak" probe has undergone tests by an independent firm, and has demonstrated cycle life testing of >1,000,000 without degradation of its performance. BantamPak" socket/probe combinations have been proven successful in high frequency testing of leading edge CPU logic devices. ECT will quote volume pricing for BantamPak" and related products in mid-July following the SEMICON West Conference in San Jose, California.
Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, POGOŽ test contacts, and bare and loaded PCB test fixtures. Corporate manufacturing, service, and support facilities are ISO registered with locations in the United States, Europe, and Asia. The company has been awarded numerous patents and participates actively in developing industry standards. ECT Semiconductor Test Group is located at 3020 South Park Drive, Tempe, AZ 85282.
For further product information, please contact Ellen Santoni, Corporate Communications, at Everett Charles Technologies; Tel (909) 925-9332; FAX (909) 925-9395. Additional information is available on the World Wide Web at https://ectinfo.com Media Contacts Ellen Santoni, Everett Charles Technologies (909) 625-9357 [email protected] Patricia Rosenberg, Rosenberg Public Relations (714) 953-2975 [email protected]
BantamPak" is a trademark and POGO is a registered trademark of Everett Charles Technologies.
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