Root Part
Test Center
in. (mm)
CSP5 .020 (0,50)
CSP8 .032 (0,80)

High Performance Contact Solutions for Semiconductor Test Packages
High density packages (BGA, CSPs, µBGAs) continue their expanding popularity in today's modern PCBs. Increasing rise times and increasing signal density affect all areas of interconnection technology.

Test probes and Pogo® contacts continue to demonstrate their flexibility in newer demanding test/contact areas. Ostby Barton has years of experience in designing and producing high performance contacts needed in applications for: higher frequency test, low resistance measurements, high cycle life requirements, new solder technology processes, and other test connections (memory test, burn-in, handler apps, etc.)

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