Flip Chip Carrier
ECT's innovative Modular Interposerú Design means you invest in industry standards, not in specific customer part numbers. To provide improved economies, ScanMan" features reusable Modular Interposers that are manufactured to meet chip carrier standard sizes. You'll virtually eliminate the need to individually fixture each customer part. ECT offers a standard body-sized Modular Interposer for each substrate family. This economical approach saves valuable time-to-market due to the fact that you won't be required to build and debug a proprietary fixture. Simply install the Modular Interposer that corresponds to your customer's standard substrate size, load the new program for the test configuration, slide the automation unit into place and start your test run.
Automated and Manual Modes For Complete Process Compatibility
In developing ScanMan's" innovative technology, ECT considered every aspect of substrate manufacturing and test. The result is a system fast enough to handle all levels of substrate test with features that are flexible to fit your particular process orientation. ScanMan" operates in either fully-automated or manual mode to conform to your production requirements.
In full-automation mode, ScanMan" delivers unprecedented test accuracy with speeds that are up to ten times faster than flying probers - fast enough for mid-level and long production runs. Yet the system allows you to switch from automation to manual test in just seconds. Automation docking is accomplished easily and efficiently, in as little as four seconds. And un-docking is just as easy. If you are interrupting the automation cycle to test a prototype board, chances are you won't have to change the Modular Interposer. Simply call up the robot path stored in ScanMan"'s memory, complete the manual test, re-dock the automation unit and switch back to full-automated operation. ScanMan" begins exactly where it stopped in the automation cycle, with no time-consuming realignment.
Every feature of ScanMan" is built to heighten your productivity. To increase automated efficiency and facilitate product handling ease, ScanMan" utilizes industry standard JEDEC trays. ScanMan" further enhances throughput and productivity by continuous system operation during tray load and unload. No other test technology achieves the speed and test accuracy of ScanMan".
Flexible Failure Handling Protocol
ScanMan" lets you decide the protocol for handling bad boards. In automated mode, failed substrates can be automatically off-loaded to ScanMan's" built-in dumpster, so no faulty units go up the line. Or you can select ECT's patented AutoMarkú process to automatically mark boards and return them to the JEDEC tray along with good units. A third option allows software marking so that board failures are notated in software and coded for further inspection downstream in your process. This innovative, flexible handling capability means ScanMan" works the way that's best for you.
Lower Cost Per Test. Higher Yields. More Profit From Your Test Process
Most advantageous is ScanMan's" dramatically lowered cost per test. ScanMan's" Modular Interposer Design eliminates the need to build a custom fixture for every job. Plus, with new throughput and test accuracy, you can build higher profits by putting more jobs through the shop and dramatically minimizing false passes. These benefits make ScanMan" the most productive and flexible test platform for flip chip carriers.
ScanMan" Features & Benefits
Fixture: Uses existing wired fixtures and ECT ValuGrid¨ fixtures. 100 mil pitch, bottom side universal grid with 13,440 test points
Fixture size: 19.2" (487.7mm) by 7.0" (177.8mm)
Continuity Resistance: less than five Ohms**
Isolation Resistance: greater than 10 MegOhms
Facilities and Environmental:
Power: 110/220V, 50/60 Hz, 15/7.5A (dedicated line required)
Air: 100 to 120 lbs./psi, 25 cfm, clean, oil-free, dry
Vacuum: 20 in. (508mm) Hg minimum, 2 cfm
Temperature: 41¡ to 80¡ F (5¡ to 27¡ C)
Relative Humidity: 38% to 55% non-condensing
*Actual throughput may vary.
**Actual results will depend on board conditions and design.
Proper maintenance of tester is necessary to achieve these results.
Patents pending, (delete Snap II from trademark section)
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